the advancement of microelectronics industries, ther is a noticeable
trend in the requirement for miniature packages with higher i/o and
industries have been looking for ways and methods to achieve thest
Singapore asahi has been continuously striving toweards the
development of interconnects materials and is pleased to present our
latest development,the ultra solder balls.
Ultra Solder Balls are manufactured under stringent control
to ensure consistant sphericity of every solder ball. in order to
provide an excellent surface brightness, our innovative technology
ensures that the size tolerance is free from impurities such as oil
and dust particles.
Tight size tolerance in every solder ball, which determines
the co-planarity of the packages, is another aspect of our technology.
Ultra Solder Balls comes in various alloy composition and
sizes catering to the industries needs the size of the solder balls
ranges from 10 mils. to 35 mils. (0.254 mm. to 0.889 mm.) ; other
sizes are available upon request.