Based on the careful selection of stencil material and informed study of the design of apertures, PumpPrint® Technology enables a wide range of adhesive patterns to be successfully deposited using a standard screen printer. Further enhancing this high throughput process is the addition of new techniques such as ProFlow® DirEKt Imaging , which increases the speed, repeatability and flexibility over that of traditional adhesive dispensers. Because adhesives are printed instead of dispensed, PumpPrint® technology enhances throughput and gives manufacturers the flexibility to utilize existing printing resources instead of purchasing new dispensing equipment. The single stroke process ensures a constant cycle time – independent of the number of adhesive deposits – which provides greater control over line utilization and product scheduling.

PumpPrint® Specifications:

Stencils mounted using standard mesh mounting fame using polyester or a frame tensioning system
Available in standard thicknesses from 1.0mm to 3.0mm or up to 8mm for special applications
Allows deposit heights from 75µm to 1mm.
Compatible with component sizes from 0603 to large QFPs
Stencils generated using Gerber, HPGL, FXF and ODB++ of DEK can scan direct from a PCB

PumpPrint® Benefits:

Significantly improved throughput over traditional adhesive dispensing
Faster, more flexible and more cost-efficient than dispensing
Nozzle changeovers eliminated
Allows re-deployment of existing resources
Underside routing clears components, cut and clinched through hole leads, paste and solder mask.
Stencils are lightweight and solvent resistant
Available in VectorGuard® format