Electroform technology delivers ultimate control over stencil thickness and uniformity, ensuring outstanding paste volume consistency for fine pitch applications. Electroform stencils provide superior performance and ensure seal contact to the pad(s), pad paste deposit and a greater percentage volume of paste on pad. The reactive force created by these stencils provides for an even distribution of paste and allows for a more clean release of paste from the aperture.Electroform stencils are very effective for printing paste on SMT boards with fine pitch parts spread over a large area and provide excellent print performance for applications with miniature BGAs, ultrafine pitch QFPs and small components such as 0201s. Electroform is also the perfect enabling technology for packaging applications such as wafer bumping. And, as the industry transitions to lead-free manufacturing, Electroform stencils will become a necessity, as they improve solder paste release for some of the more challenging lead-free paste formulations.

Electroform Stencil Specifications:

Available thicknesses: 1 mil (25µm) to 12 mil (300µm) in .01 mil (2.5µm) increments
Aperture capability: from 1 mil (50µm)
Component pitch: 4 mil (100µm) onwards
Available foils: VAHT, Mid-seal, Low-seal, VectorGuard™

Electroform Stencil Benefits:

Smooth, trapezoidal sidewalls maximize solder paste release
High Seal Technology for 1:1 stencil open to pad, for PB-free applications
Improved solder paste release ideal for Pb-free paste formulations