| Application
|
Effective
in soldering bare-copper, HALS, nickel-plated and
solder-plated boards assemblies. The flux can be
applied by foaming, dipping and waving method. No
saponifiers, neutralizers or detergents are necessary
to be added in the post-wash compartment to aid
removal of flux residue. The wash and rinse water
is neutral and biodegradable making disposal directly
down the drain possible |
Halide-free,
organic acid activated water soluble flux for wave
soldering. Excellent wetting on IC's materials like
Alloy 42, Nickel, Copper and its alloys. The post-residue
after tinning can be removed with cold water. Lower
ionic level can be achieved with final DI-water
rinsed. |
A
water-based halide-free, organic acid activated
water-soluble flux for Microelectronics package's
leads tinning by dipping or wave soldering. . Provides
excellent wetting on IC's materials like Alloy 42,
Nickel, Copper and its alloys. |
